ASIC Architect
Etched
- San Jose, California, United States
- Onsite
- Posted Aug 5, 2025
Job description
About the role
The Computer Architect will design next‑generation AI accelerators, creating and optimizing compute architectures for inference workloads. The role involves performance modeling, architectural specification, cross‑functional collaboration with RTL, verification, physical design and software teams, and guiding designs from concept through silicon.
About the company
Etched builds hardware for frontier intelligence, co‑designing chips, racks, software and manufacturing to deliver high‑throughput, low‑latency inference solutions. Backed by hundreds of millions from top‑tier investors and staffed by leading engineers, the company is redefining the AI infrastructure layer and operates as an in‑person team in San Jose.
Requirements
- PhD in Computer Science, Electrical Engineering, Computer Engineering, or related field
- 5+ years of experience in computer architecture, ASIC design, or related fields
- Strong understanding of computer architecture fundamentals including pipelines, memory hierarchies, and interconnects
- Experience with performance modeling and architectural simulation tools
- Hands‑on experience designing and optimizing floating‑point datapaths or arithmetic‑intensive circuits and working with advanced process nodes
- Proficiency in Rust, C/C++, or Python for modeling and analysis
- Knowledge of modern processor microarchitecture and design tradeoffs
- Strong analytical and problem‑solving skills with attention to detail
- Excellent communication skills and ability to work in cross‑functional teams
- Experience with AI/ML accelerator architectures and dataflow optimization
- RTL design and verification (Verilog/SystemVerilog)
- Experience with cycle‑accurate simulation tools (gem5, SystemC, or custom simulators)
- Knowledge of power and performance analysis methodologies
- Familiarity with ASIC design flow and physical design constraints
- Publication or presentation record at architecture conferences (ISCA, MICRO, HPCA, etc.)
- Hands‑on experience with tapeout and silicon bring‑up